一种新型的剖面化学染色技术研究  

Research on a New Cross-Section Chemical Staining Technology

作　　者：曹婷 姚雪霞 CAO Ting;YAO Xuexia(Founder Microelectronics International Co.,Ltd.,Shenzhen 518116,China)

机构地区：[1]深圳方正微电子有限公司,广东深圳518116

出　　处：《电子与封装》2020年第7期57-60,共4页Electronics & Packaging

摘　　要：化学染色法是一种常见的PN结形貌分析方法。目前常规的化学染色技术有磨角法、滚槽法、电解水氧化法和剖面染色法。提出了一种新型的剖面化学染色技术,在传统的剖面染色法基础上新增了表面剥层、染色及观察步骤,可突破常规化学染色技术的局限,实现对PN结分布的观测及PN结缺陷的定位分析。进一步研究发现在新型剖面染色法的染色步骤使用超结染色液,可显著提升化学染色的效果和成功率。应用该化学染色技术,大大降低了半导体产品反向工程及失效分析的时间和成本,为PN结分析提供了方向。Chemical staining is a common PN junction method.At present,conventional chemical staining techniques include grinding angle method,rolling tank method,electrolytic water oxidation method and cross-section staining method.In this paper,a new cross-section chemical staining technology is proposed,which adds the steps of surface stripping,staining and observation to the traditional cross-section staining method.It can break through the limitations of conventional chemical staining technologies.It can also realize the observation of PN junction distribution and the defect location analysis of PN junction.Furthermore,it is found that the use of super junction staining solution in the new chemical staining step can significantly improve the effect and success rate of chemical staining.The time and cost for reverse engineering and failure analysis of semiconductor products are greatly reduced.And it provides a direction for PN junction analysis.

关 键 词：化学染色 常规染色法 剖面染色法 超结染色液 PN结缺陷定位 

分 类 号：TN306[电子电信—物理电子学]