面向TGV封装的纳米玻璃粉末回流工艺  

Reflow Technology of Nano-Glass Powder for TGV Packaging

作　　者：杜晓辉[1] 刘帅 朱敏杰 Du Xiaohui;Liu Shuai;Zhu Minjie(Sensor and Network Control Center,Instrumentation Technology and Economy Institute,Beijing 100055,China)

机构地区：[1]机械工业仪器仪表综合技术经济研究所传感与网络控制中心,北京100055

出　　处：《微纳电子技术》2020年第7期562-567,共6页Micronanoelectronic Technology

基　　金：国家自然科学基金资助项目(61704064);国家重点研发计划项目(2018YFB2003700)。

摘　　要：基于玻璃通孔(TGV)技术的微电子机械系统(MEMS)封装可用于传感器无引线封装,研究了基于纳米玻璃粉末热回流工艺的新型TGV实现方法。采用球磨技术制备玻璃粉末,且通过研究干法和湿法球磨工艺,使粒径小于1μm的纳米玻璃粉末的分布占比之和达到95.6%。将纳米玻璃粉末填充到硅槽里,再经过高温回流后,获得TGV结构。回流的玻璃用于粘接硅片样品,粘接强度超过7 MPa。纳米玻璃粉末在1000℃真空条件下保温4 h,回流的玻璃能够有效填充带硅柱的大平面凹槽和高深宽比凹槽。该工艺为玻璃微加工和无引线封装提供了新思路。Micro-electromechanical system(MEMS)packaging based on through glass vias(TGV)technology can be used for sensor leadless packaging.A new implementation method of TGV based on the nano-glass powder reflow process was studied.The nano-glass powder was fabricated by using ball grinding.The dry and wet ball grinding processes were investigated to obtain nano-glass powder.The sum of distribution proportions for nano-glass powder with a particle size of less than 1μm reaches 95.60%.The nano-glass powder was filled into silicon grooves,and the TGV structure was obtained by the high temperature reflow process.The reflowed glass was used to bond the silicon wafer samples.The bonding strength is more than7 MPa.The nano-glass powder was placed under vacuum conditions at 1000℃for 4 h.The reflowed glass can effectively fill the large-plane and high-aspect-ratio grooves with silicon columns.This process provides a new idea for glass micro-machining and leadless packaging.

关 键 词：微电子机械系统(MEMS) 无引线封装 玻璃通孔(TGV) 纳米玻璃粉末 回流 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]