基于倒装芯片制备白光LED灯丝的研究进展综述  

Review of Research on White LED Filament Fabrication Based on Flip Chip

作　　者：陈跃 卢肖 钟诗圆 邹军 石明明 徐文博 杨磊 杨忠 汤雄 李超 陈狄飞 CHEN Yue;LU Xiao;ZHONG Shiyuan;ZOU Jun;SHI Mingming;XU Wenbo;YANG Lei;YANG Zhong;TANG Xiong;LI Chao;CHEN Difei(Shanghai Institute of Technology,Shanghai 201418,China;Zhejiang Emitting Optoelectronic Technology Co.,Ltd.,Jiaxing 314100,China;Shanghai Homelite Technology Co.,Ltd.,Shanghai 201601,China;Shanghai Lite-Way Lighting Appliance Co.Ltd.,Shanghai 200127,China;Hangzhou Silan Azure Co.,Ltd.,Hangzhou 310018,China;Zhejiang Meike Electric Co.,Ltd.,Shaoxing 312300,China)

机构地区：[1]上海应用技术大学,上海201418 [2]浙江亿米光电科技有限公司,浙江嘉兴314100 [3]上海厚睦莱电器科技有限公司,上海201601 [4]上海亮威照明科技股份有限公司,上海200127 [5]杭州士兰明芯科技有限公司,浙江杭州310018 [6]浙江美科电器有限公司,浙江绍兴312300

出　　处：《中国照明电器》2020年第5期12-21,41,共11页China Light & Lighting

基　　金：国家自然科学基金(61901270);上海帆船计划(17YF1419200);浙江省科技计划项目(2018C01046)。

摘　　要：倒装LED灯丝基于倒装芯片制备,区别于普通白光LED灯丝,制备工艺上一些调整使得倒装LED灯丝灯具有发光效率高、散热能力强、工艺简单、灯丝寿命长等优点,具有极大的市场前景。综述了近年来倒装芯片的制备方法以及创新性较强或较为实用的部分倒装LED灯丝的制备方法,如平面涂覆法,全周光LED灯丝,柔性LED灯丝,立体灯丝光片等,并对倒装LED灯丝的未来发展方向及应用前景进行了展望。Flip LED filament is based on flip chip preparation, which is different from ordinary white LED filament. Some adjustments in the preparation process make the flip LED filament lamp have the advantages of high luminous efficacy, better heat dissipation, simple process and long filament life, and have great market application prospects. This article reviews the preparation methods of flip chip and some of the more innovative or practical methods of preparing part of the flip LED filament, including plane coating method, full-circle LED filament, flexible LED filament, three-dimensional light-emitting sheet, etc., and proposes the future development trends of flip LED filament.

关 键 词：倒装芯片 灯丝 白光LED 全周光 

分 类 号：TN383.2[电子电信—物理电子学]