5G功放板翘曲问题研究  

Research on Warping Solution of 5G PA Board

作　　者：安维[1] 曾福林[1] 王志坚[1] 李敬科[1] AN Wei;ZENG Fulin;WANG Zhijian;LI Jingke(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2020年第4期204-207,共4页Electronics Process Technology

摘　　要：为解决5G功放板PCB的异常翘曲问题,从PCB的生产加工过程进行了分析,经过一系列的实验模拟验证,找出5G功放板PCB翘曲的主要影响因素,优化了PCB的生产控制,解决了PCB在组装过程中的翘曲问题,对PCB的生产制造提供一定的指导建议。To solve the problem of abnormal warping of 5G PA PCB,the production process of the PCB are analyzed.Through a series of experimental simulation verification,the main factors that affect the warping of the PCB are found out,the production control of PCB is optimized,and the warping during PCB assembly is solved,which can provide certain guidance for PCB manufacturing.

关 键 词：PCB 翘曲 5G 功放 

分 类 号：TN605[电子电信—电路与系统]