CBGA焊球热疲劳及寿命仿真分析  

Simulation Analysis on Thermal Fatigue and Life of CBGA Soldering Balls

作　　者：李九峰[1] LI Jiufeng(Luoyang Research Institute of Electro-optical Equipment of AVIC,Luoyang 471009,China)

机构地区：[1]中国航空工业集团公司洛阳电光设备研究所,河南洛阳471009

出　　处：《电子工艺技术》2020年第4期218-221,共4页Electronics Process Technology

摘　　要：由于BGA封装芯片的I/O引脚数目多、所占空间小,得到了广泛应用。在长期服役过程中BGA芯片受到复杂的热、电、力作用使焊球产生疲劳失效,特别是在航空航天等高可靠性产品领域。通过温度加速度试验模拟了产品的工作年限,找到了有效的工艺改进方法。BGA packaging chip has been widely used because of its large number of I/O pins and small space.In the long-term service,BGA chip is subject to complex heat,electricity and force,which causes fatigue failure of soldering ball,especially in aerospace and other high reliability products.Through the temperature acceleration test,the working life of the product is simulated,and the effective process improvement method is found.

关 键 词：CBGA 热疲劳 组装工艺 置换锡球 

分 类 号：TN605[电子电信—电路与系统]