提高电路板设计品质的检查方法  

Inspection Method for Improving the Design Quality of Circuit Board

作　　者：邵疆 SHAO Jiang(Giga Force Electronics Co.,Ltd,Shanghai 201203,China)

机构地区：[1]上海季丰电子股份有限公司,上海201203

出　　处：《集成电路应用》2020年第7期32-35,共4页Application of IC

基　　金：上海市科技企业技术创新课题项目。

摘　　要：基于多层电路板向电子元件高密度、低功率、稳定性发展,并不断缩小体积、提高性能、增加功能、降低成本的趋势,给电路板设计者提出许多全新的挑战。要求Layout工程师在设计过程中既能实现硬件需求,又能满足结构要求。在降低成本的同时,要求最短时间内完成产品的制造与焊接、组装。在提高效率的同时,品质不断提升,给后续的产品测试争取更多时间。阐述电路板设计过程中避免失误、总结经验、优化流程、复制品质。Based on the development of multilayer circuit board to electronic components with high density,low power and stability,and the trend of reducing volume,improving performance,increasing function and reducing cost,many new challenges are put forward to circuit board designers.Layout engineers are required to meet both the hardware requirements and the structural requirements in the design process.At the same time of cost reduction,it is required to complete the manufacturing,welding and assembly of products in the shortest time.At the same time of improving efficiency,the quality is constantly improving,and more time is needed for subsequent product testing.This paper describes how to avoid mistakes,summarize experience,optimize process and copy quality in the process of circuit board design.

关 键 词：集成电路 印制电路板 芯片管脚 光绘文件 检查清单 

分 类 号：TN406[电子电信—微电子学与固体电子学] TN41