一种IC功能测试板芯片失效电性定位技术  

Location Technology of Electrical Fault for IC Function Test Board

作　　者：刘兴辉 LIU Xinghui(Giga Force Electronics Co.,Ltd,Shanghai 201203,China)

机构地区：[1]上海季丰电子股份有限公司,上海201203

出　　处：《集成电路应用》2020年第7期45-47,共3页Application of IC

基　　金：上海市科技企业技术创新课题项目。

摘　　要：分析表明,半导体行业内有许多设计公司会设计功能测试板对即将上市的芯片进行模拟测试其功耗,波形输出以及是否能正常工作等。模拟测试过程就会遇到芯片有功能失效问题,需要带板测试通过仪器定位到问题所在,此种功能失效电性定位分析应用极大地减少客户测试过程中是否能复现的顾虑,并能够直观地得到想要的结果。也极大提高整个测试效率从而有更充足的时间改良芯片版图设计。The analysis shows that many design companies in the semiconductor industry will design functional test boards to simulate the power consumption,waveform output and normal operation of upcoming chips.In the process of simulation test,there will be functional failure of the chip,so it is necessary to locate the problem through the instrument through the strip test.The application of such functional failure electrical positioning analysis can greatly reduce customers’concerns about whether it can be repeated in the test process,and directly obtain the desired results.It also greatly improves the overall test efficiency and allows more time to improve chip layout design.

关 键 词：集成电路测试 功能测试 电性定位 失效分析 

分 类 号：TN407[电子电信—微电子学与固体电子学] TN406