红外探测器湿法工艺关键设备制造技术研究  

Research on the Manufacturing Technology of Wet Process Equipment for Infrared Detector

作　　者：张伟锋[1] 亢喆 吴卿[2] ZHANG Weifeng;KANG Zhe;WU Qing(The 45^th Research Institute of CETC,Beijing 100176,China;The 11^th Research Institute of CETC,Beijing 100016,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176 [2]中国电子科技集团公司第十一研究所,北京100016

出　　处：《电子工业专用设备》2020年第4期17-19,64,共4页Equipment for Electronic Products Manufacturing

摘　　要：介绍了红外探测器制造工艺流程,着重阐述了碲镉汞(HgCdTe)、锑化铟(InSb)红外焦平面探测器制造工去胶清洗、背面保护膜清洗、表面减薄工艺特殊性及湿法清洗技术重要性。结合红外探测器基片材料软脆特性,重点论述无损伤超洁净擦洗技术、自动称重减薄腐蚀技术等设备制造关键技术。This paper introduces the manufacturing process of infrared detector,and expounds emphatically the particularity of stripping cleaning,back protective film cleaning,and surface thinning process,as well as the importance of wet cleaning in the HgCdTe and InSb IRFPA detector manufacture.Based on the soft and brittle characteristics of infrared detector substrate,the key technologies of equipment manufacturing,such as non-damage super clean scrubbing technology,automatic weighing and thinning corrosion technology,are emphatically discussed.

关 键 词：红外探测器 湿法清洗 无损伤擦洗 表面减薄 自动称重 

分 类 号：TN605[电子电信—电路与系统]