统计过程控制在光刻工序中的应用  

Application of Statistical Process Control in Photolithography

作　　者：宋玲玲 SONG Lingling(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China)

机构地区：[1]中国电子科技集团公司第四十七研究所,沈阳110032

出　　处：《微处理机》2020年第4期33-36,共4页Microprocessors

摘　　要：简要介绍了微电子元器件制造过程工艺流程涉及的关键工序,重点介绍了光刻技术的基本原理,通过分析确定了光刻工艺中的关键工序为涂胶工艺,进而确定了关键工艺参数——光刻胶厚度。简要介绍了IC元器件生产过程统计质量控制和评价流程,以及统计过程分析理论。列举了IC元器件制造生产线光刻胶厚度短期和长期统计的数据结果,通过数据统计分析,综合评价了关键工序的能力。通过监控结果发现并及时解决生产线实际问题,较好的验证了过程统计在IC元器件制造过程中的应用验证和控制效果,提升了生产线的管理水平,确保了产品质量控制的要求。The key processes involved in the manufacture of IC components are briefly introduced,with emphasis on the basic principle of photolithography technology. Through analysis, it is determined that the key process of photolithography is gelatinization process, and then the key process parameter i.e.photoresist thickness is determined. The process of statistical quality control and evaluation of IC components manufacture is also briefly introduced, as well as the theory of statistical process analysis.Combining theory with practice, the short-term and long-term statistical results of photoresist thickness of IC component production line, and the capability of key processes through data statistical analysis are comprehensively evaluated. Through the monitoring results, the practical problems of the production line are found and solved in time, the application verification and control effect of process statistics in the IC manufacturing process of components are well verified, the management level of the production line is improved, and the requirements of product quality control are ensured.

关 键 词：微电子元器件制造 光刻 统计过程控制 光刻胶厚度 

分 类 号：TN305.7[电子电信—物理电子学]