半导体代工厂研磨废水的堵管研究  

Engineering Methods on Block Removal Induced by CMP Waste Water in Semiconductor Foundry

作　　者：张云秀 赵记 陆宇杰 Zhang Yun-xiu;Zhao Ji;Lu Yu-jie

机构地区：[1]中芯国际集成电路制造(上海)有限公司

出　　处：《节能与环保》2020年第8期68-69,共2页

摘　　要：半导体代工厂化学机械研磨(CMP)研磨液的主要成分为二氧化硅(SiO2)颗粒,排放废水中也含有SiO2。此物质会造成悬浮物(SS)偏高,在14~28nm制程中会与同时排放的化学药剂反应造成厂务废水系统堵管,在压滤单元会造成滤布堵塞。工程实践表明,除了物理清洗的解决方式,采用化学清洗可以有效去除管路和滤布的淤堵,保证系统运行稳定,减少清洗人工。Slurry containing SiO2 particles was used in CMP process for wafer surface plainnazation in semiconductor manufacture foundry.So there is SiO2 in drainage accordingly,which may impact[SS]data in final charge channel.Meanwhile,SiO2 particles may have reactions with chemicals in CMP process and lead to related piping block and impact foundry production;SiO2 also can be the root cause of Filter Press cloth block.It is proved by engineer applications that chemical flush can remove the blocks instead of man-hand physical cleaning,which can make waste water treatment system running more stable and save cost.

关 键 词：半导体 化学机械研磨 研磨废液 酸洗 碱洗 制程排放系统 

分 类 号：X76[环境科学与工程—环境工程] TN432[电子电信—微电子学与固体电子学]