AIN金属化基板烧结麻点技术研究及解决方法  

Technical Research and Solution of Pitting Problem of Sintering on AIN Metalized Substrate

作　　者：李斌 田晨光 党军杰[1] 王宁[1] LI Bin;TIAN Chen-guang;DANG Jun-jie;WANG Ning(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2020年第2期77-80,共4页Hybrid Microelectronics Technology

摘　　要：针对AIN基板烧结工序产生的麻点问题,进行理论分析并设计了实验方案,通过SEM等分析方法进行机理分析判断麻点成分,准确定位问题所在,经实验验证,通过调整原材料的选择、合适的工艺参数、以及烧结炉的状态等措施,可以有效的解决麻点问题,提高产品的质量。Aiming at the pitting problem in the sintering process of AIN substrate,the thesis theoretically analysis and designs an experimental plan,mechanism analysis is used to determine the pitting component through SEM and other analytical methods to accurately locate the problem.After experimental verification,by adjusting the choice of raw materials,the appropriate process parameters and the state of the sintering furnace can effectively solve the problem of pitting and improve the quality of the product.

关 键 词：AIN基板 AIN金属化 烧结 麻点 

分 类 号：TG148[一般工业技术—材料科学与工程]