电子封装用钢基体金属外壳熔封工艺优化  

Optimization of Melt Sealing Process of Steel Base Metal Case for Electronic Packaging

作　　者：张凤伟 宁峰鸣 冯东[1] 罗亚丽 ZHANG Feng-wei;NING Feng-ming;FENG Dong(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所圣达科技实业有限公司,230088

出　　处：《混合微电子技术》2020年第2期86-89,共4页Hybrid Microelectronics Technology

摘　　要：钢基体外壳是电子封装外壳的重要组成部分。目前的熔封工艺会导致外壳引线根部出现一定比例玻璃爬高的现象,在后续使用时引线受力容易出现引线根部玻璃裂纹。本文分析了引线根部裂纹机理,采用正交实验法对引线的退火、熔封温度、保温时间、气氛进行了试验,确定了最优的熔封工艺参数。为金属外壳的生产提供了有效指导。Steel base metal case is an important part of electric packaging case.At present,the melt sealing process will lead to a certain proportion of glass climbing at the root of pins of the case,and the glass crack at the root of the pins is easy to appear in the subsequent use of the lead.In this paper,the crack mechanism of the root of the lead is analyzed.The annealing,sealing temperature,holding time and atmosphere of the lead are tested by orthogonal experiment method,and the optimal process parameters of the seal are determined.It provides effective guidance for the production of metal case.

关 键 词：熔封工艺 玻璃裂纹 工艺优化 

分 类 号：TN305.94[电子电信—物理电子学]