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作 者:张小敏 李起龙 杜海涛 王斌 ZHANG Xiao-min;LI Qi-long;DU Hai-tao;WANG Bin(College of Materials Engineering,Jinling Institute of Technology,Nanjing 211169,China;Nanjing Wasin Fujikura Optical Communication Limited,Nanjing 210038,China)
机构地区:[1]金陵科技学院材料工程学院,江苏南京211169 [2]南京华信藤仓光通信有限公司,江苏南京210038
出 处:《高校化学工程学报》2020年第4期1069-1075,共7页Journal of Chemical Engineering of Chinese Universities
基 金:金陵科技学院创客项目“复材梦之翼”(2017007);南京市科技计划项目(201805009)。
摘 要:为了制备高抗氧化性能铜粉,采用AgNO3为银源,化学镀法制备了不同含银量的超细镀银铜粉。将镀银铜粉作为导电填料制备导电胶,系统研究了制备工艺对导电胶性能的影响。结合扫描电镜(SEM)、X射线衍射(XRD)、X射线荧光(XRF)、流变仪测试、四探针电阻率测试、万能电子拉力机、热分析(DSC/TG)等分析手段,研究了镀银铜粉的形貌、晶体结构、导电胶黏度、电性能、强剪切度和固化过程热性能。结果表明:镀银铜粉具有较好的导电性及抗氧化性能。推荐最佳的导电胶制备工艺为:65%镀银铜粉、35%的环氧树脂,在150℃下固化10 min,该导电胶制备出薄膜的电阻率为8.73×10^-4Ω×cm,焊接铜片剪切强度为11 MPa,,具有优异的抗老化性能。In order to prepare copper powder with high oxidation resistance,silver-coated copper powders with different silver contents were prepared by electroless plating using AgNO3 as silver source.The silver-coated copper powders were used as conductive fillers to prepare electrical conductive adhesive.Effects of preparation process on the properties of conductive adhesives were systematically studied.The morphology,crystal structure of silver-coated copper powder,and the viscosity,electrical properties,shear strength and thermal properties of conductive adhesives and curing process were studied by scanning electron microscopy(SEM),X-ray diffraction(XRD),X-ray fluorescence(XRF),rheometer,four-probe resistivity test,universal electronic tension machine and thermal analysis(DSC/TG).The results show that the silver-plated copper powder has good conductivity and oxidation resistance.The optimum preparation process of conductive adhesive is recommended as follows:65%silver-plated copper powder,35%epoxy resin,cured at air 150℃for 10 min.The resistivity of the film with excellent aging resistance prepared by this conductive adhesive is 8.73×10^-4Ω·cm,and the shear strength of the welded copper sheet is 11 MPa.
分 类 号:TG146.[一般工业技术—材料科学与工程]
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