配置不同类型探测器的X射线荧光测厚仪对比研究  

A Comparative Study of X-ray Fluorescence Thickness Gauges with Different Detectors

作　　者：尹丽晶[1,2] 武利会 陈美静 YIN Li-jing;WU Li-hui;CHEN Mei-jing(The 13th Research Institute,CETC,Shijiazhuang 050051;National Semiconductor Device Supervision and Inspection Center,Shijiazhuang 050051)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051 [2]国家半导体器件质量监督检验中心,石家庄050051

出　　处：《环境技术》2020年第4期205-209,共5页Environmental Technology

摘　　要：X射线荧光测厚法是对电子元器件金属镀层厚度进行测量的主要方法之一。本文对X射线荧光测厚仪的工作原理、结构进行了分析,对其核心组成部分探测器的三种类型的性能参数进行了对比,并选取相应型号的测厚仪进行了对比测试,对测量结果进行了分析。X-ray fluorescence thickness measurement is one of the main methods to measure the thickness of metal coating on electronic components.In this paper,the working principle and structure of the x-ray fluorescence thickness gauge are analyzed.The performance parameters of three types of detectors,which are the core part of the thickness gauge,are compared,and the measurements are conducted by thickness gauge of the corresponding type,and the results are analyzed.

关 键 词：X射线荧光测厚仪 探测器 Si-PIN SDD 

分 类 号：TH842[机械工程—仪器科学与技术]