基于热阻网络模型的铜基微通道热沉设计优化  

Optimization of copper microchannel heat sink in flow boiling application based on thermal resistance network model

作　　者：华珍[1] 马驰骋[1] HUA Zhen;MA Chicheng(School of Transportation and Vehicle Engineering,Shandong University of Technology,Zibo 255049,China)

机构地区：[1]山东理工大学交通与车辆工程学院,山东淄博255049

出　　处：《山东理工大学学报（自然科学版）》2020年第6期14-19,24,共7页Journal of Shandong University of Technology:Natural Science Edition

基　　金：国家自然科学基金项目(11702162)。

摘　　要：研究表明微通道的截面形状、尺寸以及数量显著影响流体在通道中的传热性能。基于热阻网络模型和计算流体力学(CFD,computational fluid dynamics)模拟,对适用于流动沸腾散热的铜基微通道设计进行了热性能分析。根据实验和模拟计算结果,在确保微通道内热边界层发展区满足恒定壁温条件下,8个平行的尺寸为200μm高,800μm宽,10 mm长的铜基微通道阵列即可满足一般的流动沸腾应用所需要的对流散热量(如6 kW/m^2)。该微通道热沉设计可以在30 min内达到稳定,也可以在相对较短的时间内将目标系统维持在稳定的合理工作温度。此外,实验结果表明在微通道入口处的流体冲击流动可以提高微通道壁面与工作流体之间的对流换热系数,并且在很大程度上降低了壁温。In this study,the design of copper microchannel for flow boiling heat transfer application was investigated.To make sure that the development zone of thermal boundary layer meets the constant wall temperature condition of the microchannel,the experimental device was optimized and simulated based on thermal resistance network and CFD(computational fluid dynamics).The results showed that,instead of using more number of longer and larger micro-channels,a total number of 8 parallel rectangular micro-channels of 200μm high,800μm wide and 10 mm long were able to ensure the sufficient forced convection and heat dissipation(i.e.6 kW/m^2)required by the later flow boiling application.It was also noticed that the flow impingement effect at the entrance of the microchannel substantially improved the convective heat transfer coefficient and reduced the wall temperature to a large extent.

关 键 词：流动沸腾传热 对流换热冷却 恒定壁温 铜基微通道热沉 热阻网络模型 CFD模拟 

分 类 号：V231.1[航空宇航科学与技术—航空宇航推进理论与工程]