高功率密度紫外LED结温测量与仿真  

Measurement and Simulation of the Junction Temperature of High Power Density UV-LED

作　　者：钱坤 韩秋漪[1] 荆忠 张善端[1] QIAN Kun;HAN Qiuyi;JING Zhong;ZHANG Shanduan(Institute for Electric Light Sources,Fudan University,Shanghai 200433,China;Shanghai Machine Optoelectronic Technology Co.,Ltd.,Shanghai 201612,China)

机构地区：[1]复旦大学电光源研究所,上海200433 [2]上海迈芯光电科技有限公司,上海201612

出　　处：《中国照明电器》2020年第7期1-9,共9页China Light & Lighting

基　　金：2016年上海市军民融合专项计划"聚脲涂装设备及双固化聚脲弹性体的研发和产业化"。

摘　　要：散热性能的好坏决定了高功率密度紫外LED的辐射效率和寿命。其中结温是判断芯片热学性能的重要指标之一。本文设计了紫外LED的水冷系统,采用正向电压法和红外测温法测量了紫外LED芯片的结温以及基板温度,同时利用COMSOL进行实验系统仿真。结果表明,在电流20 A、水冷温度20℃时,单颗紫外LED芯片的输入功率为73.38 W,功率密度815.3 W/cm^2,结温70℃。仿真与实验结果相符。Heat dissipation affects the lifespan and radiant efficiency of high power-density UV LED.The junction temperature is one of the key parameters to evaluate thermal performance.In this paper,both junction temperature and substrate point temperature were measured by two methods respectively,including forward voltage method and infrared thermometry.The water cooling system was designed and simulated through COMSOL software.The results show the junction temperature is 70℃for UV LED with current 20 A,input power 78.38 W,power density 815.3 W/cm^2,at cooling water temperature 20℃.The simulation agree well with the experimental results.

关 键 词：紫外LED 结温 正向电压法 红外测温法 COMSOL 

分 类 号：TN312.8[电子电信—物理电子学]