非等温DSC研究EMC的固化动力学  

Study on Curing Kinetics of EMC by DSC

作　　者：王殿年 郭本东 杨春梅 WANG Diannian;GUO Bendong;YANG Chunmei(Eternal Electronic Materials Co.Ltd.,Kunshan 215301,China)

机构地区：[1]长兴电子材料有限公司,江苏昆山215301

出　　处：《电子与封装》2020年第9期10-13,共4页Electronics & Packaging

摘　　要：采用非等温差示扫描热量仪(DSC)对环氧塑封料共混物体系的固化过程进行了研究。利用T-Φ外推法确定了固化工艺温度,并用Kissinger、Ozawa和Crane法计算共混体系固化反应的表观活化能Ea、指前因子A和固化反应级数等动力学参数。结果表明,TPTP和DBU促进剂具有高温区快速固化的特点,使用这两种促进剂该体系的活化能均在62 kJ/mol以上,反应级数n均小于1,表明该体系的固化反应是一个复杂反应,使用T-Φ外推法计算出凝胶温度分别为66.15℃和70.65℃。The curing reactions of epoxy molding compound was studied by non-isothermal differential scanning calorimetric(DSC).Curing temperature was calculated by T-Φextrapolation.The curing kinetics parameters of blend systems,including the apparent activation energy(Ea),the frequent factor(A),the reaction order(n)and other parameters were calculated by Kissinger,Ozawa and Crane method.The results indicated that the TPTP and DBU catalyst were quickly reacted at high temperature,the apparent activation energy were above 62 kJ/mol and the reaction order were below 1,so this reaction is a complex reaction.The gel temperature of TPTP/EMC and DBU/EMC was 66.15℃and 70.65℃,respectively.

关 键 词：DSC 环氧塑封料 促进剂 

分 类 号：TN305.94[电子电信—物理电子学]