高密度电子系统的微热控技术研究  

Research on Micro-Thermal Control Technology of High Density Electronic System

作　　者：李晖[1] 李左翰 胡少勤[1] 米佳[1] 毛世平[1] LI Hui;LI Zuohan;HU Shaoqing;MI Jia;Mao Shiping(The 26th Research Institute of China Electronics Technology Group Corporation,Chongqing400060,P.R.China;The 24th Research Institute of China Electronics Technology Group Corporation,Chongqing400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十六研究所,重庆400060 [2]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2020年第4期548-554,共7页Microelectronics

摘　　要：在摩尔定律提出之后的50年时间里,电子系统的集成度和组装度不断提高,功率和热流密度越来越大,微热管理技术已成为高密度电子系统(包括元器件、芯片、组/部件及系统本身)设计与制造的重要研究目标。文章分析了微热控技术的发展背景,叙述了微通道、微热管和微喷射等三种基本热控系统的典型结构和工作原理。最后,介绍了近年来具有代表性的微热控技术的发展现状和技术成果。In the fifty years since Moore’s law was proposed,the integration and assembly of electronic systems are constantly improved,and the power consumption and heat flux are increasing.Micro-thermal management technology has been becoming important research target for the design and manufacturing of high-density electronic systems(including components,chips,modules and systems themselves).The development background of micro-thermal control technology was analyzed in this paper.Then,the typical structure and working principle of three basic thermal control systems,such as micro channel,micro heat pipe and micro injection were described.At last,the development status and achievements of micro-thermal control technology in recent years were introduced.

关 键 词：电子系统 微热控技术 散热管理 微通道 微热管 微喷射 

分 类 号：TN402[电子电信—微电子学与固体电子学] TN406