面向半导体器件的电化学微纳制造技术  

Electrochemical micro/nano-machining for semiconductor devices

作　　者：韩联欢 杜炳谦 许瀚涛 时康 周剑章[1] 杨防祖[1] 詹东平[1] 田昭武[1] HAN Lianhuan;DU Bingqian;XU Hantao;SHI Kang;ZHOU Jianzhang;YANG Fangzu;ZHAN Dongping;TIAN Zhaowu(State Key Laboratory of Physical Chemistry of Solid surfaces,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005,China;School of Aerospace Engineering,Xiamen University,Xiamen 361102,China)

机构地区：[1]厦门大学化学化工学院,固体表面物理化学国家重点实验室,福建厦门361005 [2]厦门大学航空航天学院,福建厦门361102

出　　处：《厦门大学学报（自然科学版）》2020年第5期747-755,共9页Journal of Xiamen University：Natural Science

摘　　要：由于电化学加工技术无工具磨损、无残余应力、无表层和亚表层损伤和热效应,在先进制造领域具有不可替代的作用.面对超大规模集成电路、微纳机电系统和微纳器件等新兴产业的重大需求,电化学微纳加工技术应运而生.围绕“微纳米尺度空间限域电化学反应”这一关键科学问题,本文将在介绍电化学微纳加工技术的基础上,全面综述具有厦门大学特色的约束刻蚀剂层技术及其在半导体材料加工原理、方法和设备等方面的研究进展.Electrochemical machining plays an irreplaceable role in industrial manufactures,because of no tool wear,no residual stress,no surface and sub-surface damages,and no thermal effect.To meet the great demands of the newly rising industries,such as ultra-large scale integrate circuit(ULSI),microelectromechnical system(MEMS),and the micro/nano-devices.The key scientific problem of electrochemical micro/nano-machining is to confine the electrochemical reactions spatially in micro/nano-meter scale.In this review,we give a brief introduction to electrochemical micro/nano-machining,and then concentrate on the principles,methods and instruments of the confined etchant layer technique(CELT),which was originally developed by Xiamen University.

关 键 词：约束刻蚀剂层技术 电化学微加工 电化学纳米加工 先进制造 半导体微纳器件 半导体晶圆 

分 类 号：TB[一般工业技术]