低温无铅钎料合金系研究进展  

Recent advances in research on low-temperature lead-free solder alloy systems

作　　者：黄明亮[1] 任婧 HUANG Mingliang;REN Jing(Key Laboratory of Liaoning Advanced Welding and Joining Technology,School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,Liaoning Province,China)

机构地区：[1]大连理工大学材料科学与工程学院先进连接技术辽宁省重点实验室,辽宁大连116024

出　　处：《电子元件与材料》2020年第10期1-10,共10页Electronic Components And Materials

基　　金：国家自然科学基金(U1837208,51671046);中央高校基本科研业务费项目(DUT20LAB122)。

摘　　要：随着消费类电子产品向着低功耗、多功能化、高集成度、微型化、绿色制造的方向发展,其对电子制造封装技术与工艺提出了新的要求,以应对消费类电子产品可靠性所面临的严峻挑战。首先,电子封装制造过程中表面贴装工艺(SMT)通常使用的传统Sn-Ag-Cu钎料合金回流工艺温度(240~260℃)较高,不可避免地会带来较大的热损伤、热能耗以及散热困难等问题;其次,随着器件厚度降低,要求所使用的芯片、PCB等基板更薄,这样由热膨胀系数不匹配产生的应力所引起的翘曲现象将更加显著,且在封装过程中各种焊接缺陷更易出现;此外,不耐热元器件、温度敏感器件的焊接需求逐渐增长,传统的中高温组装工艺已无法满足新型电子封装技术的需求。在SMT过程中通过使用低温无铅钎料降低工艺温度是有效解决消费类电子产品的可靠性问题的方式之一。本文对国内外低温无铅钎料合金的发展进行了总结,详细介绍了Sn-Zn基、In基、Sn-Bi基三类不同低温无铅钎料合金的发展及研究现状,阐明了三类钎料合金在不同领域应用的优缺点,分析了未来低温组装的研发方向和实现途径。As the development of consumer electronics towards low energy consumption,multi-functionalities,high integration,miniaturization and green manufacturing,new requirements are put forward for the electronic packing technology to meet the severe challenges by the reliability of consumer electronic products.Firstly,the traditional high reflow temperature(240-260℃for Sn-Ag-Cu,)in Surface Mount Technology(SMT)inevitably brings some problems,such as thermal damage,heat consumption and dissipation.Secondly,with the reduction of Z-height stack-up,the chip and PCB substrates become thin,which resulted in warpage and/or other soldering defects due to the thermal expansion coefficient mismatch during the packaging process.Moreover,the heat-resistant components and temperature sensitive devices become popular,and the traditional temperature assembly process cannot meet the demands for the new electronic packaging technology.In SMT process,it is one of the effective means to solve the reliability problems of consumer electronic products by using low-temperature lead-free solder to reduce interconnection.Therefore,recent studies on the low-temperature lead-free solder alloys are surveyed in the present work.The advantages and disadvantages of three low temperature lead-free solders,namely,Sn-Zn,In,and Sn-Bi based solder alloys,are discussed among different fields.The development of the three low-temperature solder alloys is analyzed to guide their application for future consumer electronics.

关 键 词：低温无铅钎料 Sn-Zn基钎料 综述 In基钎料 Sn-Bi基钎料 消费类电子产品 

分 类 号：TG425[金属学及工艺—焊接]