高密度金丝键合中的劈刀系列化实验  

Experiments on Series of Bonding Wedges in High Density Gold Wire Bonding

作　　者：李颖凡 王安瑞 张齐燕 蔡运红 LI Yingfan;WANG Anrui;ZHANG Qiyan;CAI Yunhong(The 10th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036

出　　处：《电子工艺技术》2020年第5期283-287,共5页Electronics Process Technology

摘　　要：针对高密度细间距金丝键合中劈刀选型困难的问题,筛选出11种劈刀作为试验对象,研究它们在不同材质上的匹配性与键合能力,以及在高密度细间距、深腔/近壁特殊应用状态下的工艺特性。通过焊点形态、拉力测试及显微镜拍照对比方式,得出劈刀可靠性变化曲线以及使用寿命。最后通过归纳分析,梳理出11种劈刀适用范围,供实际生产选型。In order to solve the problem in the selection of bonding wedges in high density and fi ne pitch gold wire bonding,eleven kinds of wedges are selected as experimental subjects to study their compatibility and bonding ability in different materials,and a few of technological tests research are developed in state of special application with the conditions of high density,fi ne pitch,deep cavity and closer wall.Then,the varying curve of wedges reliability and operation life are obtained by the contrast method of solder joint shape,tensile tests and microscope photograph.Finally,through induction and analysis,the applicative range of these wedges are sorted out for actual production selection.

关 键 词：高密度金丝键合 劈刀选型 键合能力 细间距 深腔 

分 类 号：TN454[电子电信—微电子学与固体电子学]