BGA封装NC管脚对ESD测试的影响  

The Influence of BGA Package NC Pin on ESD Testing

作　　者：刘春冉 张峰 贺轶斐 胡旻 LIU Chun-ran;ZHANG Feng;HE Yi-fei;HU Min(China National Aeronautical Radio Electronics Research Institute,Shanghai 200241,China;不详)

机构地区：[1]中国航空无线电电子研究所,上海200241 [2]陆军装备部航空军事代表局驻上海地区航空军事代表室,上海200031

出　　处：《航空电子技术》2020年第3期56-60,共5页Avionics Technology

摘　　要：焊球阵列封装电路已广泛应用在航空电子产品中,其静电放电测试参考的测试标准中不要求对未键合空脚进行静电放电测试,在实际静电放电测试过程中发现,对焊球阵列封装电路未键合未键合空脚进行静电放电测试后会产生电路失效现象。通过分布电容方法分析以及不同管脚组合测试验证,证明了焊球阵列封装电路的未键合空脚在经过人体模型静电放电测试后,会对电路产生影响。The BGA package ICs are widely used in avionics equipment.According to the ESD testing standards published,the testing for the unbonded No-Connect Pin is not required.But in the case of BGA circuits,some ICs fail after the ESD testing to the unbonded No-Connect Pin.A distributed capacitance analysis and ESD testing to the NC pin,signal and ground indicate that BGA circuits are affected by the human body Model ESD testing to the unbonded No-Connect pin.

关 键 词：静电放电敏感度 焊球阵列封装 空管脚 人体模型 

分 类 号：TN305.94[电子电信—物理电子学]