提升窄发光LED耐高温老化性能的封装技术研究  

Research on Packaging Technology for Improving High-temperature Aging Resistance of LED with Slender Light-emitting Surface

作　　者：李正凯 谢志国 李福海 潘利兵 章勇[2] LI Zhengkai;XIE Zhiguo;LI Fuhai;PAN Libing;ZHANG Yong(Foshan Nationstar Optoelectronics Co.,Ltd.,Foshan 528000,China;Institute of Semiconductors,South China Normal University,Guangzhou 510631,China)

机构地区：[1]佛山市国星光电股份有限公司,广东佛山528000 [2]华南师范大学半导体科学技术研究院,广东广州510631

出　　处：《中国照明电器》2020年第8期12-16,共5页China Light & Lighting

摘　　要：针对窄发光型LED产品耐高温老化性能不佳的问题,从封装材料和工艺两个方面展开研究。实验表明不同黏度、硬度、折光率胶材的窄发光型LED产品在高温老化下光通维持率的差异较小;采用单一变量法对比分析不同支架特性,包含杯型微结构、白胶材质、热沉铜材、功能区镀银层厚度等对窄发光型LED产品耐高温老化性能的影响,结果显示PCT材质的支架耐高温性能较好;此外,实验结果显示全离心封装工艺能有效提升产品耐高温老化性能。通过综合对比分析,为提升窄发光型LED产品的耐高温老化性能提出切实可行的产业化方案。In order to solve the problem of poor high-temperature aging resistance of LED with slender light-emitting surface,this paper studied two aspects of packaging materials and technology.The results show that the luminous flux maintenance rate of LED products with different viscosity,hardness and refractive index glue has little difference under high temperature aging.The influence of different leadframe characteristics,including cup microstructure,plastic material,heat sink material,silver coating thickness of functional area,on the high temperature aging resistance of LED was compared and analyzed by single variable method.The results indicate that PCT leadframe has better high temperature resistance performance.In addition,the experiment indicates that the complete centrifugal packaging process can effectively improve the high temperature aging resistance of products.With comprehensive comparison and analysis,a practical industrialization scheme is proposed to improve the high temperature aging resistance of LED products with slender light-emitting surface.

关 键 词：窄发光 LED 老化 光衰 离心 封装 

分 类 号：TN312.8[电子电信—物理电子学]