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作 者:李晓冬 曹家凯 姜兵 胡世成 张建平 刘杰[2] Li Xiaodong;Cao Jiakai;Jiang Bing;Hu Shicheng;Zhang Jianping;Liu Jie(Novoray Corporation,Lianyungang 222000,China;National Special Superfine Powder Engineering Research Center of China,School of Chemical Engineering,Nanjing University of Science and Technology,Nanjing 210094,China)
机构地区:[1]江苏联瑞新材料股份有限公司,江苏连云港222000 [2]南京理工大学化工学院,国家特种超细粉体工程技术研究中心,南京210094
出 处:《微纳电子技术》2020年第10期835-840,共6页Micronanoelectronic Technology
基 金:江苏省科学技术厅重点研发计划(产业前瞻与共性关键技术)项目(BE2015098);江苏省科学技术厅科技成果转化专项资金项目(BA2019040)。
摘 要:首先将超细硅微粉中的铀(U6+)元素分散在酸性浆料中;然后使用SiO2气凝胶和蜂窝陶瓷复合介孔吸附装置对其进行吸附完成材料精选与提纯,使超细硅微粉中的铀(U)元素总量降低;最后在无污染后加工技术的基础上,采用火焰熔融法球形化后获得高纯低放射性球形硅微粉。实验结果表明,通过材料精选与提纯,超细硅微粉中的铀(U)含量(质量分数)可以从9.7×10^-9降至6×10^-10,最终获得的高纯低放射性球形硅微粉的铀(U)含量为7×10^-10。制备的硅微粉具有高球形度、粒度分布窄且可控等特点,应用时表现出流动性好、黏度低、粗粒含量少(溢料长)等理想效果,满足大规模集成电路(LSI)封装对高纯低放射性球形硅微粉填料的要求。The uranium(U6+)element in the ultrafine silicon powder was firstly dispersed in the acidic paste,and then was adsorbed by the SiO2 aerogel and honeycomb ceramic composite mesoporous adsorption device to complete the material selection and purification,so as to reduce the total amount of uranium(U)element in the ultrafine silica powder.Finally,on the basis of pollution-free post-processing technology,spherical silica powder with high purity and low radioactivity was obtained after spherified by flame melting method.The experimental results show that through material selection and purification,the content(mass fraction)of the uranium(U)in the ultrafine silicon powder can be reduced from9.7×10^-9 to 6×10^-10 and the content of the uranium(U)in the high purity and low radioactivity spherical silica powder is 7×10^-10.The prepared silica powder has characteristics of high sphericity,narrow and controllable particle size distribution and so on,and shows ideal applications performances,such as good fluidity,low viscosity,less coarse grain content(overflow length),etc,meeting the requirements of large scale integrated circuit(LSI)package for high-purity and low-radioactivity spherical silica powder fillers.
关 键 词:球形硅微粉 低放射性 大规模集成电路(LSI)封装 球形度 粒度分布
分 类 号:TN304.12[电子电信—物理电子学]
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