厚膜基板导电胶溶剂溢出行为试验研究  

Experimental Study on Conductive Adhesive Solvent Overflow of Thick Film Substrates

作　　者：张坤 ZHANG kun(The 43rd Research Institute of CETC,Heifei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2019年第3期43-45,共3页Hybrid Microelectronics Technology

摘　　要：生产线产品所用的H 20 E导电胶存在溶剂流淌出到键合区,影响键合质量的问题。针对该质量问题从导电胶与基板两个角度研究解决措施。分别对导电股加热和吹风处理以及基板浸泡无水乙醇和擦拭无水乙醇等四种措施进行试验,试验结果表明擦拭无水乙醇可以有效降低基板的表面能,抑制导电胶溶剂溢出。根据试验结果分析了导电肢溶剂溢出的原因,查阅相关资料结合试验结果提出了导电胶溶剂溢出的解决措施。Solvent in the H20E conductive adhesives used in the production line products bleed out to the bonding area,which affects the bonding quality.For this quality problem,the solution measures on adhesive and substrate are studied.Four kinds of measures,such as heating and blowing treatment of conductive adhesives and immersing absolute ethanol in the substrate and wiping anhydrous ethanol,were tested.The results showed that wiping anhydrous ethanol can effectively reduce the surface energy of the substrate and inhibit the overflow of conductive adhesive solvent.According to the test results,the reasons for overflow of solvent are analyzed.The relevant data is combined with the test results to propose a solution for the leakage of the conductive adhesive solvent.

关 键 词：导电胶 溶剂溢出 表面能 厚膜基板 

分 类 号：TN405[电子电信—微电子学与固体电子学] TQ436[化学工程]