浅谈非接触式印刷工艺应用于厚/薄膜电路的可行性分析  

Feasibility Analysis of Contactless Printing Technology Applied in Thick/Thin Film Circuit

作　　者：孙玉玲 SUN Yu-ling(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2019年第3期46-49,共4页Hybrid Microelectronics Technology

摘　　要：非接触式印刷工艺由于具有低成本、工艺简单、可图案化、材料利用率高、承印基底选择范围广以及无需精密掩模版等优势而被广泛应用于多种电子元器件以及功能电子电路的加工中,在学术界和产业界都受到了广泛的关注。本文将主要对非接触式印刷工艺中的几种喷墨印刷技术的工作原理、工艺特点及其应用领域等方面做简要概述,同时对该工艺应用于厚薄膜电路的可行性进行分析。Since contactless printing technology has advantages of low cost,simple process,pattemable,high material utilization,wide selection of substrate and no need for precision mask,etc.It has been widely used in the processing of various electronic components and functional electronic circuits,and attracted wide attention in academia and industry.In this paper,the working principle,process characteristics and application fields of several inkjet printing technologies in contactless printing process are briefly summarized.At the same time,the feasibility of applying this technology in thick and thin film circuit is analyzed.

关 键 词：非接触 喷墨式印刷 厚/薄膜电路 丝网印刷 真空蒸发 

分 类 号：TN405[电子电信—微电子学与固体电子学] TS804[轻工技术与工程]