基于金丝球焊的芯片间互联技术研究  

Research on Chip-to-Chip Interconnect Technology Based on Gold Wire Ball Bonding

作　　者：朱仁贤 曾辉[1] ZHU Ren-xian;ZENG Hui(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088

出　　处：《混合微电子技术》2019年第3期50-53,共4页Hybrid Microelectronics Technology

摘　　要：文本描述了基于金丝球焊工艺基础上的一种芯片间互联技术,本方法先在芯片表面键合区预植金球,然后采用金丝球焊工艺将键合二点落在预植球上,实现芯片与芯片间的键合。课题采用全自动金丝键合机在芯片表面键合Ф25μm金丝。通过统计键合一致性、稳定性并结合键合可靠性评价来优化参数,获得合适的预植球参数、键合二点与预植球相对位置参数及键合二点参数。This article describes chip-to-chip interconnect technology based on gold wire ball bonding process.With this method,gold balls are firstly pre-soldered in the bonding area of the chip surface,and then two bonding points are placed on the pre-soldereci balls by the gold wire ball soldering process.And interconnect of chip-to-chip is realized.The Ф25μm gold wire is used for bonding on the surface of the chip by fully automatic gold wire bonding machine.The parameters are optimized by statistical bonding consistency,stability and bonding reliability evaluation,and the appropriate pre-soldering parameters,bonding two-point and pre-soldering relative position parameters and bonding two-point parameters are obtained.

关 键 词：预植球 芯片间互联 

分 类 号：TN405.94[电子电信—微电子学与固体电子学]