影响储能焊封装工艺可靠性的因素分析及研究  

Analysis Research on Factors Affecting Reliability of Projection Welding

作　　者：郝振宇 刘俊夫[1] HAO Zhen-yu;LIU Jun-fu(No.43 Research Institute of GETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2019年第4期63-68,共6页Hybrid Microelectronics Technology

摘　　要：储能焊是一种比较可靠的气密性封装工艺,在小体积、轻量化、高可靠电子元器件领域应用广泛。本文从外壳状态、工艺参数、组装过程方面入手,对影响储能焊封装工艺可靠性的因素进行了分析及研究,并对提高储能焊封装工艺可靠性提出了建议。Projection welding is a kind of reliable hermetic packaging process which is widely used in the fields of small size,light weight and high reliability electronic components.The article analyzed and researched the factors affecting the reliability of projection welding from packaging factor,technological parameters and manufacturing process,then some advices about improving the reliability are proposed.

关 键 词：封装 焊接 参数 因素 

分 类 号：TG442[金属学及工艺—焊接]