银基焊膏的研究进展  

Research Progress on Silver-based Solder Paste

作　　者：范玉曼 赵君[1] 魏明霞 王剑平[1] 高勤琴[1] 谢明[1] FAN Yu-man;ZHAO Jun;WANG Jian-ping;GAO Qin-qin;XIE Ming(Kunming Insitute of Precious Metals,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.Ltd.,Kunming 650106,China;China Aviation Development Shenyang Liming Aviation Engine Co.Ltd.,Shenyang 110043,China)

机构地区：[1]昆明贵金属研究所,贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,昆明650106 [2]中国航发沈阳黎明航空发动机有限责任公司,沈阳110043

出　　处：《贵金属》2020年第S01期34-42,共9页Precious Metals

基　　金：国家重点研发计划(2017YFB0305700);国家自然科学基金(NSFC-云南联合基金)(U1602271,U1602275);云南省稀贵金属材料基因工程(202002AB080001-1)。

摘　　要：银具有高导电导热、耐腐蚀、抗氧化、延展性好等特性,制粉后添加不同合金元素与助焊剂以合适的比例混合制得的焊膏,在金属焊接与电子表面装联领域有着广泛的应用。结合近年来银基焊膏的最新研究进展,综述了银基焊膏中焊粉与助焊剂的研究现状,展望了银基焊膏的发展趋势。Silver has the characteristics of high conductivity,high temperature resistance,corrosion resistance,and good ductility.When powder is made,different alloying elements and fluxes are mixed in a suitable ratio to prepare solder pastes that are widely used in the field of metal welding and electronic surface mount application.Combining with the latest research progress of silver-based solder paste in recent years,this article reviews the two major components of silver-based solder paste:the research status of solder powder and flux,and prospects the future development trend of silver-based solder paste.

关 键 词：银基焊膏 银基合金 助焊剂 

分 类 号：TG425[金属学及工艺—焊接]