高温钎料焊膏研究进展  

Research Progress on High Temperature Solder Paste

作　　者：戎万 操齐高[1] 郑晶[1] 孟晗琪[1] 姜婷[1] 郑博瀚 RONG Wan;CAO Qi-gao;ZHENG Jing;JIANG Tin;MENG Han-qi;ZHENG Bo-han(Northwest Institute For Non-ferrous Metal Research,Xi'an 710016,China)

机构地区：[1]西北有色金属研究院,西安710016

出　　处：《贵金属》2020年第S01期43-47,共5页Precious Metals

基　　金：陕西省重点研发计划项目(2019GY-158);国家重点研发计划(2017YFB0305702)。

摘　　要：针对高温钎料使用便利性的需求,综述了高温钎料焊膏的相关研究现状。介绍了焊膏各组分在焊膏制备和钎焊中的作用,阐述了镍基、铜基、银基、钛基和金基五种常用高温钎料及其焊膏的应用与发展趋势,为高性能高温钎料焊膏的开发提供了参考。The research status of high temperature solder paste was reviewed for the convenience of high temperature solder.The effect of each component on the preparation and brazing of solder paste was introduced.Mean while,the application and development trend of five commonly high-temperature solders including nickel base,copper base,silver base,titanium base and gold base were described.It provided a reference for the development of excellent high temperature solder paste.

关 键 词：焊膏 镍基钎料 铜基钎料 银基钎料 

分 类 号：TG425[金属学及工艺—焊接]