无氧铜电真空器件表面洁净工艺研究  

Study on the Surface Cleaning Process of Oxygen-Free Copper Electric Vacuum Device

作　　者：王殿 魏宇祥 WANG Dian;WEI Yuxiang(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原032400

出　　处：《电子工业专用设备》2020年第5期13-16,共4页Equipment for Electronic Products Manufacturing

摘　　要：无氧铜器件作为微波功率放大以及超导器件的核心器件,由于信号传输需求,封装环节经常在真空环境中进行,故如何对无氧铜电真空器件进行表面洁净成为真空封装工艺中的重点。在经过化学除油、酸洗、水洗工艺后利用热氮气对无氧铜进行表面烘干封存,经过镀膜、焊接工艺后进行实验室性能分析,对样品清洗后表面状态、表面元素、镀膜质量以及焊接性能等产品指标进行验证,均符合产品指标要求,该洁净工艺可行有效。Oxygen-free copper devices are the core components of microwave power amplification and superconducting devices.Due to the signal transmission requirements,the packaging process is often carried out in a vacuum environment.Therefore,how to clean the surface of oxygen-free copper electrical vacuum devices has become the focus of the vacuum packaging process.After chemical degreasing,pickling,and water washing,the oxygen-free copper is dried and sealed on the surface with hot nitrogen gas.After the coating and welding process,the laboratory performance analysis is carried out to analyze the surface state,surface elements,coating quality and quality of the sample after cleaning.Product indicators such as welding performance are verified to meet the product indicator requirements,and the cleaning process is feasible and effective.

关 键 词：无氧铜 电真空器件 湿法清洗 

分 类 号：O649.2[理学—物理化学]