高气密性碱金属微气室低温阳极键合技术研究  

Research on low temperature anodic bonding technology for high hermeticity micro alkali metal micro chamber

作　　者：杜婷 李兴辉[1] 韩攀阳 陈海军[1] 蔡军[1] 冯进军[1] DU Ting;LI Xinghui;HAN Panyang;CHEN Haijun;CAI Jun;FENG Jinjun(National Key Laboratory of Science and Technology on Vacuum Electronics,Beijing Vacuum ElectronicsResearch Institute,Beijing 100015,China)

机构地区：[1]中国电子科技集团公司第十二研究所微波电真空器件国家级重点实验室,北京100015

出　　处：《传感器与微系统》2020年第11期14-17,共4页Transducer and Microsystem Technologies

基　　金：国家自然科学基金重点资助项目(61831001);国家重点研发计划资助项目(2017YFC0109102)。

摘　　要：对基于硅孔成型和玻璃—硅低温阳极键合实现微型气室的工艺技术进行研究。分析了不同基片表面状态、温度和电压对阳极键合工艺的影响并进行实验验证。基片表面气泡观察、气室剖面电镜照片分析、键合强度测试和气室密封性测试结果表明,该工艺技术能够得到综合性能良好的微气室。在180~300℃温度范围内,样品的键合强度在几兆帕(MPa)到几十兆帕范围,微气室漏气率均优于1.0×10-13Pa·m3·s-1,表明该工艺技术可用于碱金属微气室制备。A micro vapor cell manufacturing technology based on silicon through hole forming and low temperature anode bonding of silicon and glass is investigated. The effects of substrate surface state,temperature and voltage on anode bonding are analyzed and verified by experiments. The results of bubble observation on substrate surface,analysis of scanning electron microscope photos of vapor cell section,bonding strength test and cell hermeticity test show that micro vapor cells fabricated by this technology are with good comprehensive performance. In the temperature range of 180 ~ 300℃,the bonding strengths are from several MPa up to several decades MPa,and the gas leakage rates of the bonding cells are less than 1. 0 × 10-13 Pa·m3·s-1,which indicates that the technology can be used in the fabrication of micro alkali metal vapor cells.

关 键 词：碱金属 微气室 微加工技术 低温阳极键合 表面处理 

分 类 号：TN305[电子电信—物理电子学] TP212[自动化与计算机技术—检测技术与自动化装置]