共晶芯片数及芯片位置对陶瓷共晶封装LED发光性能的影响  

Effect of Number and Location of Eutectic Chips on Luminescent Properties of Ceramic Eutectic Packaged LED

作　　者：王世龙 熊传兵 汤英文 李晓珍 刘倩 WANG Shi-long;XIONG Chuan-bing;TANG Ying-wen;LI Xiao-zhen;LIU Qian(School of Physics and Information Engineering,Minnan Normal University,Zhangzhou 363000,China)

机构地区：[1]闽南师范大学物理与信息工程学院,福建漳州363000

出　　处：《发光学报》2020年第11期1421-1430,共10页Chinese Journal of Luminescence

基　　金：国家自然科学基金(51072076);福建省科技厅产学研合作项目(2018H6015);福建省高校创新团队培育计划(201821)资助项目。

摘　　要：在大小为5.80 mm×2.55 mm×0.50 mm的8芯陶瓷封装基板上分别共晶了8颗和4颗1.125 mm×1.125 mm(45 mil×45 mil)的倒装蓝光LED芯片,在4.15 mm×2.55 mm×0.50 mm的6芯基板上共晶了6颗和3颗同规格芯片。在部分样品芯片侧边涂围了高反射白墙胶,研究了涂覆白墙胶对器件光功率的影响。在部分涂围了白墙胶样品的芯片顶面涂覆荧光粉硅胶混合层制备了白光器件,研究了共晶芯片数及共晶位置对蓝光/白光器件光功率、光通量和色温的影响。结果表明,共晶芯片的数量(额定功率)与陶瓷基板面积的匹配程度、陶瓷基板热电分离金属层与芯片共晶位置的匹配度会显著影响陶瓷封装LED的发光性能。Eight and four 1.125 mm×1.125 mm(45 mil×45 mil)flip-flop blue LED chips were eutectic on an 8-core ceramic package substrate with a size of 5.80 mm×2.55 mm×0.50 mm.Six and three chips of the same specification were co-crystallized on a 6-core substrate of 4.15 mm×2.55 mm×0.50 mm.The high reflection white wall glue was coated on the side of some sample chips,and the effect of white wall glue on the optical power of the device was studied.White light devices were fabricated by coating silica gel mixed layer on the top surface of the chip partially coated with white wall glue.The effects of the number of eutectic chips and the position of the eutectic on the optical power,luminous flux and color temperature of the blue and white light devices are studied.The results show that the matching degree between the number of eutectic chips(rated power)and the ceramic substrate area,and the matching degree between the thermoelectric separation metal layer of ceramic substrate and the eutectic position of the chip can significantly affect the luminous performance of ceramic packaged LED.

关 键 词：陶瓷封装 金锡共晶 热平衡 热电分离 

分 类 号：TN304[电子电信—物理电子学]