Bi对Sn-Cu-Zn无铅钎料性能的影响  

Effect of Bi on Properties of Sn-Cu-Zn Lead-free Solder

作　　者：徐春刚 曾春平[1] 索春光[1] 张文斌[2] XU Chungang;ZENG Chunping;SUO Chunguang;ZHANG Wenbin(College of Science,Kunming University of Science and Technology,Kunming 650500,China;College of Mechanical and Electrical Engineering,Kunming University of Science and Technology,Kunming 650500,China)

机构地区：[1]昆明理工大学理学院,云南昆明650500 [2]昆明理工大学机电工程学院,云南昆明650500

出　　处：《热加工工艺》2020年第17期29-32,37,共5页Hot Working Technology

基　　金：中国南方电网有限责任公司科技项目(YNKJXM20170732)。

摘　　要：以Sn-0.7Cu-Zn三元合金钎料为基础,研究添加不同含量的Bi元素对合金的熔点、电导率、润湿性以及力学性能的影响。通过差式扫描量热仪(DSC)、万能拉力试验机分别对不同配比的钎料合金进行熔点和力学性能测试,采用铺展性试验法表征其在铜铝板上的润湿性能。研究表明:随着Bi元素含量的增加,其熔点开始下降,但熔程会增加;电导率随着Bi元素含量的增加而减少。随着Bi元素含量的增加,四元合金钎料润湿性能先增加后减少,Bi的含量为1%时可以大幅提高铜铝板上的润湿性能。Bi元素能影响合金的抗拉强度,但合金的伸长率会下降。Based on Sn-0.7 Cu-Zn ternary alloy solder,the effect of different adding content of Bi on the melting point,electrical conductivity,wettability and mechanical properties of the alloy was studied.The melting point of different solder alloys was tested by differential scanning calorimetry(DSC).The mechanical properties of the brazing materials were tested by universal tensile testing machine.The wetting properties of the brazing alloys at copper,aluminum plates were characterized by the spreading test method.The results show that the melting point begins to decrease with the increase of Bi content,but the melting range increases.The electrical conductivity decreases with the increase of Bi content.The wetting property of the quaternary alloy brazing filler metal firstly increases and then decreases with the increase of Bi content.When the content of Bi is 1%,the wetting property can be greatly improved at the copper,aluminum plates.The Bi element can affect the tensile strength of the alloy,but the elongation of the alloy will decrease.

关 键 词：Sn-Cu基合金 无铅钎料 BI 润湿性 力学性能 

分 类 号：TG425[金属学及工艺—焊接]