回流焊工艺参数对FC-LED芯片焊接强度的影响  

Influence of reflow soldering parameters on soldering strength of flip chip LED

作　　者：杨明德 李炳乾 夏正浩 罗明浩 梁胜华 Yang Mingde;Li Bingqian;Xia Zhenghao;Luo Minghao;Liang Shenghua(Wuyi University,Jiangmen 529020,Guangdong,China;Zhongshan Guangsheng Semiconductor Technology Co.,Ltd.,Zhongshan 528421,Guangdong,China)

机构地区：[1]五邑大学,广东江门529020 [2]中山市光圣半导体科技有限公司,广东中山528421

出　　处：《焊接》2020年第6期23-27,62,共6页Welding & Joining

基　　金：国家自然科学基金-青年基金项目(51602227);广东省教育厅重点平台建设跃升计划工程中心项目(GCZX-A1411);五邑大学教授启动经费项目(2015JS05);五邑大学2018年校级教学质量与教学改革工程(JX2018001)。

摘　　要：以焊接位置的抗剪强度为表征参数,将推拉力计测量推力换算成芯片焊点抗剪强度,对倒装LED封装中回流焊工艺参数进行了优化。试验结果表明,当回流炉温度设计不合理时,抗剪强度在30 MPa以下的数量比例达到17%,30~35 MPa占11%,35~40 MPa占11%,40~45 MPa占15%,45 MPa以上的个数仅占46%;而采用优化后的温度时,不存在35 MPa以下的抗剪强度,35~40 MPa占5%,40~45 MPa占6%,45 MPa以上的数量达到89%。可以看出不同的焊接温度设置对倒装LED芯片封装焊接抗剪强度能产生极大的影响,通过优化的回流焊工艺参数,可以有效的减小焊接面内空洞的大小及数量。The shear strength of the soldering position was taken as the characterization parameter,and the thrust measured by push-pull meter was converted into the shear strength of the chip solder joint.Parameters of reflow soldering in the flip chip LED package were optimized.The experimental results showed that when the design of reflux furnace temperature was unreasonable,the proportion of shear strength below 30 MPa was 17%,the proportion of 30~35 MPa was 11%,the proportion of 35~40 MPa was 11%,the proportion of 40~45 MPa was 15%,and the proportion of more than 45 MPa was only 46%.While using the optimized temperature,there was no shear strength below 35 MPa,the proportion of 35~40 MPa was 5%,the proportion of 40~45 MPa was 6%,and the proportion of more than 45 MPa was 89%.It was observed that settings of different soldering temperatures had a great impact on soldering shear strength of flip chip packaging.Through optimization of reflow soldering parameters,the size and number of cavities in the soldering surface could be effectively reduced.

关 键 词：LED FCOB 回流焊 回流曲线 

分 类 号：TG44[金属学及工艺—焊接]