钨酸钠复合添加剂深镀粗化电解铜箔表面处理工艺研究  

Deeply Coarsening Surface Treatment of Electrolytic Copper Foil with Sodium Tungstate Composite Additive

作　　者：刘耀[1] 陆冰沪 樊小伟[1] 李大双 师慧娟 杜鹏康 张钰松 谭育慧[1] 唐云志[1] LIU Yao;LU Bing-hu;FAN Xiao-wei;LI Da-shuang;SHI Hui-juan;DU Peng-kang;ZHANG Yu-song;TAN Yu-hui;TANG Yun-zhi(Jiangxi University of Science and Technology,Ganzhou 341000,China;Anhui Tongguan Copper Foil Co.,Ltd,Chizhou 247100,China)

机构地区：[1]江西理工大学,江西赣州341000 [2]安徽铜冠铜箔有限公司,安徽池州247100

出　　处：《表面技术》2020年第11期168-176,共9页Surface Technology

基　　金：国家自然科学基金(21761013,21671086)。

摘　　要：目的提高电解铜箔深镀粗化效果。方法采用电沉积对35μm电解铜箔进行表面处理。通过AFM、SEM、XRD、剥离强度测试、表面粗糙度测试以及循环伏安等分析测试手段,系统地研究了钨酸钠-HEC-SPS复合添加剂对电解铜箔形貌与性能的影响。结果粗化液中加入钨酸钠-HEC-SPS复合添加剂,可以提高粗化层均匀性和致密性,改善深镀效果,当HEC、SPS和钨酸钠添加量分别为5、50、60 mg/L时,综合深镀处理效果最佳,粗糙度Rz和剥离强度分别为7.50μm和2.14 N/mm,该性能指标显著优于粗化原液处理试样。复合添加剂促使还原峰电位由−0.644 V负移至−0.674 V,电极极化增强。电沉积速率由33.0μm/h下降至29.8μm/h,抑制效果显著。峰顶瘤点形貌由尖刺状向光滑圆润的形貌转变,效果明显改善;同时,粗化层由(111)、(200)晶面显著向(220)晶面择优取向。结论粗化液中加入钨酸钠-HEC-SPS复合添加剂可以显著提升电解铜箔深镀效果,改善剥离强度及表面粗糙度,并促进晶面向(220)晶面择优取向。The work aims to enhance the deeply coarsening effect of electrolytic copper foil.The surface treatment of 35μm electrolytic copper foils was conducted by electro-deposition method,and the influence of sodium tungstate-HEC-SPS composite additive on surface morphology and performance of electrolytic copper foil was systematically studied by AFM,SEM,XRD,peel strength test,surface roughness test and cyclic voltammetry.The sodium tungstate-HEC-SPS composite additive in the coarsening solution promoted the uniformity and compaction of coarsening coating layer,and improved the effect of deep plating.When the additive amounts of HEC,SPS and sodium tungstate were 5,50,60 mg/L respectively,the comprehensive deep plating effect was the best and the roughness Rz and peel strength reached 7.504μm and 2.139 N/mm separately.The performance indicator was better than that in coarsening sample treatment.The composite additive reduced the reductive spike potential from−0.644 V to−0.674 V,which significantly enhanced the polarization of the electrode.The rate of electro-deposition decreased from 33μm/h to 29.8μm/h,which inhibited the deposition effectively.The surface morphology of the nodule on the peak of copper foil peak turned from spininess into smoothness,and was improved obviously.Meanwhile,the preferential orientation of the copper foil coarsening layer accelerated the orientation from(111)and(200)to(220).Adding the sodium tungstate-HEC-SPS composite additive into coarsening solution can significantly enhance the deep plating effect of electrolytic copper foil,improve the peel strength and surface roughness,and promote the preferred orientation(220).

关 键 词：电解铜箔 电化学 表面 电子材料 形貌 粗糙度 

分 类 号：TQ153.1[化学工程—电化学工业]