Cu调控的TiN-Cu纳米复合膜包覆钛合金的抗菌性研究  

Antibacterial Properties of Cu-Doped TiN Composite Coatings on Ti6Al4V Alloy Substrate

作　　者：赵梦鲤[1] 刘孟寅 韩笑 纪醒明 吴杰[1] 董雷[1] 董磊[1] 李德军[1] Zhao Mengli;Liu Mengyin;Han Xiao;Ji Xingming;Wu Jie;Dong Lei;Dong Lei;Li Dejun(College of Physics and Materials Science,Tianjin Normal University,Tianjin 300387,China;Tianjin Key Laboratory of Optical Thin Film,Tianjin Jinhang Technical Physics Institute,Tianjin 300308,China)

机构地区：[1]物理与材料科学学院天津师范大学,天津300387 [2]天津市薄膜光学重点实验室天津津航技术物理研究所,天津300308

出　　处：《真空科学与技术学报》2020年第10期952-959,共8页Chinese Journal of Vacuum Science and Technology

基　　金：国家自然科学基金项目(51772209);天津自然科学基金青年项目(18JCQNJC72000和18JCQNJC73400);天津市高等学校创新团队资助项目(TD13-5077);天津市研究生科研创新项目(2019YJSS137)。

摘　　要：利用磁控共溅射技术在钛合金(Ti6Al4V)表面包覆氮化钛-铜纳米(TiN-Cu)复合膜,并通过控制Cu靶溅射功率实现对TiN-Cu薄膜中Cu含量的调节,进而实现对材料耐蚀性和抗菌性的协同调控。采用扫描电子显微镜、原子力显微镜、X射线衍射仪、能谱仪分析了包覆TiN-Cu纳米复合膜的钛合金的表面形貌、相结构、元素成分及价态,并在模拟体液条件下测试了该材料的耐腐蚀性能,通过体外抗菌实验评价了Cu含量对材料抗菌性的影响。结果表明:通过在Ti6Al4V表面包覆TiN-Cu纳米复合薄膜显著增强了材料的抗菌性;并抑制了有毒性的V4+、Al3+离子在体液中的释放。Cu靶溅射功率升高在提高TiN-Cu薄膜中Cu含量和薄膜沉积速率的同时,也导致了薄膜中大量柱状晶体结构的生成,加速了薄膜的腐蚀,但提高了抗菌性。综上,合理调控Cu的含量是协同提升TiN-Cu薄膜的耐腐蚀性及抗菌性的关键。The surfaces of Ti6 Al4 V alloy,an advanced surgical wound repairing material,were modified with Cu-doped TiN-coatings synthesized by magnetron co-sputtering of Cu and TiN targets.The influence of the Cu-content on the corrosion-resistance,antibacterial properties and toxicity of the Cu-doped TiN coatings was investigated with scanning electron microscopy,X-ray diffraction,energy dispersive spectroscope,atomic force microscopy and biological simulation test.The results show that depending on the Cu-content,the Cu-doping has a major impact.To be specific,an increase of Cu-content improved the antibacterial properties against E.coli,decreased the release of toxic ions,such as V4+ and Al3+,and reduced the corrosion resistance,possibly because of the formation of columnar grains.We suggest that the Cu-doped TiN coatings be of some technological interest for development of surgical wound repairing material of TiN-coated Ti6 Al4 V alloy.

关 键 词：钛合金 磁控共溅射 TiN-Cu复合膜 耐腐蚀性 抗菌性 

分 类 号：O539[理学—等离子体物理]