N2流量对磁控溅射制备NiTiC电阻涂层结构和电性能的影响  

Effects of Nitrogen Flow on the Microstructure and Electrical Properties of NiTiC Resistance Coatings Prepared by Magnetron Sputtering

作　　者：张晓斌[1] 李海生 ZHANG Xiao-bin;LI Hai-sheng(Department of Equipment Engineering,Henan Institute of Architectural Technology,Zhengzhou 450064,China;School of Physics and Engineering,Henan University of Science and Technology,Luoyang 471000,China)

机构地区：[1]河南建筑职业技术学院设备工程系,河南郑州450064 [2]河南科技大学物理工程学院,河南洛阳471000

出　　处：《材料保护》2020年第8期109-112,152,共5页Materials Protection

基　　金：国家自然科学基金专项基金项目(11347209)资助。

摘　　要：为了提高电子设备用NiTiC电阻涂层的导电性能,采用磁控溅射技术在VLP电解铜箔基底上制备NiTiC电阻涂层,通过试验测试研究了N2流量对其组织和电性能的影响。结果表明:随着N2流量提高,在涂层表面形成尺寸更大的颗粒,并且分布形态也更加均匀,获得了具有致密组织的涂层。提高N2流量至20 mL/min,沉积颗粒无法充分填补涂层中微孔,导致涂层表面形成大颗粒并发生部分团聚。随着N2流量提高,Ti和N发生更剧烈的反应,沉积速率逐渐变小,使得涂层内Ti原子比例减小。提高N2流量后,N元素在涂层内的比例不断增大,N2进入真空反应室后基本发生了反应溅射过程。逐渐提高N2流量后,得到了负的电阻温度系数,最低电阻温度系数出现在N2流量为15 mL/min时,此时涂层达到了最低内应力。涂层厚度先增大再降低,电阻率则呈现不断增大的变化趋势。In order to improve the conductivity of NiTiC resistance coatings for electronic equipment,the NiTiC resistance coating was prepared by magnetron sputtering on VLP electrolytic copper foil substrate,and the influence of N2 flow rate on its structure and electrical properties was studied by experimental test. Results showed that with the increase of N2 flow,larger particles with more uniform distribution were formed on the coating surface,and the coating with dense tissue was obtained. When the N2 flow rate was increased to 20 mL/min,the deposition particles could not fully fill the micropores in the coating,resulting in the formation of large particles on the coating surface and partial agglomeration. With the increase of N2 flow rate,Ti and N reacted more violently,and the deposition rate gradually decreased,resulting in a decrease in the proportion of Ti atoms in the coating. With the increase of N2 flow rate,the proportion of N element in the coating increased,and the reactive sputtering process basically occurred after N2 entered the vacuum reaction chamber. After gradually increasing the N2 flow rate,a negative resistance temperature coefficient was obtained. The lowest resistance temperature coefficient appeared when the N2 flow rate was 15 mL/min,under this condition the coating reached the lowest internal stress. The coating thickness increased first and then decreased,while the square resistance and resistivity showed an continuously increasing trend.

关 键 词：NiTiC涂层 磁控溅射 N2流量 微观组织 电性能 

分 类 号：TG174.442[金属学及工艺—金属表面处理]