无氰铜锡合金仿金电镀工艺及镀层性能  

Non-cyanide imitation gold plating process and coating properties

作　　者：郑丽 罗松 林修洲 胡国辉 王东风 张靖松 ZHENG Li;LUO Song;LIN Xiuzhou;HU Guohui;WANG Dongfeng;ZHANG Jingsong(School of Material Science and Engineering,Sichuan University of Science&Engineering,Zigong 643000,China;不详)

机构地区：[1]四川轻化工大学材料科学与工程学院,四川自贡643000 [2]重庆立道新材料科技有限公司,重庆404100

出　　处：《电镀与涂饰》2020年第21期1465-1468,共4页Electroplating & Finishing

基　　金：四川钒钛产业发展研究中心开放项目(2019VTCY-Z-03);钒钛资源综合利用四川省重点实验室项目(2018FTSZ08)。

摘　　要：在采用HEDP 15 g/L、AESS 24 mg/L和K2CO340 g/L作为复合添加剂的条件下,探讨了焦磷酸盐体系无氰铜锡合金仿金电镀配位剂和主盐浓度对镀层外观的影响,确定了以下最优工艺条件:K4P2O7·3H2O 240 g/L,Cu2P2O7·3H2O 16~18 g/L,Sn2P2O72.0~2.8 g/L。由此而电镀出的仿金镀层在黄铜基体上有良好的结合力,表面硬度比基体低,但耐磨性更好。复合添加剂对镀层的平整及抗磨损有一定的促进作用。The concentrations of main salts and complexing agent on appearance of Cu-Sn alloy coating as an imitation of gold electroplated from a cyanide-free pyrophosphate bath were studied when using a composite additive comprising HEDP 15 g/L,AESS 24 mg/L,and K2CO340 g/L.The optimal conditions were determined as follows:K4P2O7·3H2O 240 g/L,Cu2P2O7·3H2O 16-18 g/L,and Sn2P2O72.0-2.8 g/L.The coating obtained thereunder was well-adhered to brass,and had better wear resistance than brass,although its surface hardness was lower than brass.The composite additive has a certain effect on improving the flatness and wear resistance of the coating.

关 键 词：无氰仿金电镀 铜锡合金 焦磷酸盐镀液 复合添加剂 显微硬度 耐磨性 

分 类 号：TQ153.13[化学工程—电化学工业] TM507[电气工程—电器]