5G功放PCB材料的选择方法  

Material Selection of 5G PA PCB

作　　者：安维[1] 曾福林[1] 李敬科[1] 任英杰 韩梦娜 AN Wei;ZENG Fulin;LI Jingke;REN Yingjie;HAN Mengna(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China;Zhejiang Wazam New Materials Corporation,Hangzhou 311121,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057 [2]浙江华正新材料股份有限公司,浙江杭州311121

出　　处：《电子工艺技术》2020年第6期333-337,361,共6页Electronics Process Technology

摘　　要：5G产品要实现传输信号的低损耗、低延迟,就应选用低D_k、低D_f、耐高温的高频板材。5G对于高频材料的需求量暴增,出于交付及成本压力,必须寻求多样化的材料供应渠道。主要介绍了5G功放PCB的材料选择方法。To achieve low loss and low delay of transmission signals,5G products should use highfrequency boards with low D k,low D f and high temperature resistance.The demand for high-frequency materials in 5G is booming.Due to delivery and cost pressures,diversifi ed material supply channels must be found.The material selection method of 5G PA PCB is introduced.

关 键 词：功放板 5G PCB 材料 

分 类 号：TN605[电子电信—电路与系统]