异形刚挠印制板组件装联的防护工艺  

Protection Technology for Assembly of Special Shaped Rigid-flex PCB

作　　者：王卓茹 李丹 林小明 高志勇 曾凡 陈玉报 张芸 WANG Zhuoru;LI Dan;LIN Xiaoming;GAO Zhiyong;ZENG Fan;CHEN Yubao;ZHANG Yun(Beijing Aerospace Wanyuan Science&Technology Co.,Ltd.,Beijing 100176,China;Unit 93160 of PLA,Beijing 100071,China)

机构地区：[1]北京航天万源科技有限公司,北京100176 [2]中国人民解放军93160部队,北京100071

出　　处：《电子工艺技术》2020年第6期350-353,共4页Electronics Process Technology

摘　　要：基于某产品生产制造中使用异形刚挠印制板的实际需求,开展刚挠印制板组装件装联可靠性研究,通过工艺试验及微观分析,确定了有效的工艺方法及防护措施,解决了异形刚挠印制板组件在装焊、清洗、喷涂、调试、整机组装过程中遇到的技术难题,保障了产品的质量与可靠性。Based on the actual demand of using special shaped rigid-flex PCB in the production,the assembly reliability of rigid-fl ex printed circuit boards is studied.Through the process test and microscopic analysis,the effective process method and protective measures are determined,and the technical problems are solved in the assembly,soldering,cleaning,spraying,debugging and whole machine assembly,the quality and reliability of the products are ensured.

关 键 词：刚挠印制板 电子装联 可靠性 防护措施 

分 类 号：TN41[电子电信—微电子学与固体电子学]