基于微波印制电路板表面图形面积比的归一化电流计算方法及其电镀实践  

A normalized current calculation method based on graphic area ratio of microwave printed circuit board and its application in electroplating

作　　者：戴广乾[1] 曾策[1] 谢国平 阳晓明 边方胜[1] 易明生 DAI Guangqian;ZENG Ce;XIE Guoping;YANG Xiaoming;BIAN Fangsheng;YI Mingsheng(The 29th Research Institute of CETC,Chengdu 610036,China;不详)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电镀与涂饰》2020年第23期1610-1614,共5页Electroplating & Finishing

摘　　要：基于微波印制电路板“背面与正面镀金面积比不同,镀层生长速率也不同”的事实,引入了镀层厚度相对生长系数T的概念,对电镀总面积、总电流进行归一化处理和计算,建立了基于归一化电流电镀的方法。基于正反面镀金面积比,对多种微波印制电路进行筛选和分组,并在归一化电流下电镀,避免了传统方法电镀时微波印制电路板正面金层严重超标问题,金盐总消耗降幅约40%。Based on the fact that both growing rate and thickness of gold coating are different at front side and back side of microwave printed circuit board,the concept of relative growth coefficient of coating thickness was introduced.A method for electroplating at a normalized current calculated based on the normalized total area to be electroplated was established.Several kinds of microwave printed circuit boards were selected and grouped according to their gold coating area ratios of back side to front side,and then electroplated at normalized current.The problem of seriously excessive thick gold coating on the front side of microwave printed circuit board existing in traditional electroplating process was eliminated,and the total consumption of gold salt was reduced by about 40%.

关 键 词：微波印制电路板 电镀金 归一化电流 厚度 面积比 金盐消耗 

分 类 号：TQ153.18[化学工程—电化学工业]