Sb含量对Sn-Sb合金焊料电化学腐蚀行为的影响  

Effect of Sb Content on Electrochemical Corrosion Behavior of Sn-Sb Alloy Solder

作　　者：郝煜辉 王容岳 袁章福 王存 HAO Yu-hui;WANG Rong-yue;YUAN Zhang-fu;WANG Cun(Collaborative Innovation Center of Steel Technology,University of Science and Technology Beijing,Beijing 100083,China;Beijing Aobang Advanced Materials Co.,Ltd.,Beijing 101400,China)

机构地区：[1]北京科技大学钢铁共性技术协同创新中心,北京100083 [2]北京奥邦新材料有限公司,北京101400

出　　处：《有色金属（冶炼部分）》2020年第12期69-74,共6页Nonferrous Metals（Extractive Metallurgy)

基　　金：国家自然科学基金资助项目(U1738101);中央高校基本科研业务费专项资金资助项目(FRF-MP-20-17)。

摘　　要：为了评估Sn-Sb合金焊料的电化学可靠性,以Sn-xSb(x=0.5%,3%,5%,10%,质量百分数)合金为工作电极,Pt片为对电极,饱和甘汞电极(SCE,饱和KCl溶液)为参比电极,中性5%NaCl溶液为腐蚀溶液,采用电化学腐蚀试验方法,研究了Sb含量对Sn-Sb合金焊料的电化学腐蚀行为的影响。通过对合金样品的动电位极化曲线和电化学交流阻抗谱(EIS)的分析,得出Sn-Sb合金焊料耐腐蚀性下降的趋势为Sn-10Sb>Sn-5Sb>Sn-3Sb>Sn-0.5Sb。Applying Sn-xSb(x=0.5%,3%,5%,10%,mass fraction)alloy as working electrode,Pt sheet as counter electrode,saturated calomel electrode(SCE,saturated KCl solution)as reference electrode,and neutral 5%NaCl solution as corrosion solution to evaluate electrochemical reliability of Sn-Sb alloy solder and influence of Sb content on electrochemical corrosion behavior of Sn-Sb alloy solder by electrochemical corrosion test.Through analysis of potential polarization curve and electrochemical impedance spectroscopy(EIS)of alloy samples,it is concluded that corrosion resistance of Sn-Sb alloy solder decreases as Sn-10Sb>Sn-5Sb>Sn-3Sb>Sn-0.5Sb.

关 键 词：SN-SB合金 NACL 电化学腐蚀 焊料 耐腐蚀性 

分 类 号：TG143.3[一般工业技术—材料科学与工程]