装配应力对芯片可靠性的影响分析  

Analyses of Assemble Stress Influence on Chip Reliability

作　　者：黄炜[1] 吴昊 HUANG Wei;WU Hao(Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《环境技术》2020年第6期42-45,共4页Environmental Technology

摘　　要：半导体器件发生机械应力失效的直接原因是外部应力大于器件自身强度,文章以两种典型机械应力失效产品为例,采用EMMI、SEM、OBIRCH等失效分析方法,对装配后电性能失效的TR组件波控电路芯片以及温度循环、恒定加速度试验后失效的大电流低压差线性调整器产品,进行了失效原因分析,定位出两个产品的故障点,分析其失效原因。通过两个案例故障现象,结合机械应力的特点,总结出机械应力引起芯片失效的典型故障表现形式。The direct cause of the mechanical failure of semiconductor devices is that the external stress exceeds its own ability.In this article,two typical mechanical stress failure cases are introduced.Failure analysis methods like EMMI,SEM,OBIRCH are applied to analyze the electronically failed assembled TR module wave control chip,as well as the failed high-current low-voltage linear regulator products after experiments of temperature cycle and constant acceleration test.The failure spots are located and failure causes are found.In addition,the typical failure manifestations caused by mechanical stress are summarized by the combination of the two cases and principles of mechanical stress.

关 键 词：机械应力 漏电失效 失效分析 

分 类 号：TN432[电子电信—微电子学与固体电子学]