大功率微系统的微流道结构散热特性研究  

Study on Heat Dissipation Characteristics of Micro-channel Structure in High-power Microsystem

作　　者：朱家昌 张振越 郭鑫 李杨[1] ZHU Jiachang;ZHANG Zhenyue;GUO Xin;LI Yang(The 58th Research Institute of CETC,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子产品可靠性与环境试验》2020年第6期19-23,共5页Electronic Product Reliability and Environmental Testing

摘　　要：以大功率微系统为研究对象,开展了微流道结构的散热特性研究,以解决大功率微系统的高效热管理问题。首先,探讨了直线型、折线型、S型和梯型等4种不同的微流道结构对微系统散热效果的影响;然后,分析了微流道数目、宽度和高度对微流道结构传热性能的影响。研究表明,S型微流道对扇出型微系统的散热效果优于其他微流道结构,综合考虑大功率微系统内最高温度和微流道内压降,在保持冷却流体流量为10 cm^3/s不变的情况下,S型微流道数目为60,宽度为60μm,高度为250μm时达到最优散热效果,最高散热功率密度超过800 W/cm^2。Taking the high power microsystem as the research object,the heat dissipation characteristics of the micro-channel structure is studied to solve efficient thermal management problem of the high-power microsystem.Firstly,the influence of linear,polyline,Scurve and ladder micro-channel structure on the heat dissipation effect of microsystem is discussed.Then,the effect of micro-channel number,width and height on the heat transfer performance of the micro-channel structure is analyzed.The results show that the heat dissipation effect of S-curve micro-channel on fan-out microsystem is better that of other micro-channel structures.Considering the maximum temperature in microsystem and the pressure drop in micro-channel,under the condition that cooling fluid flow is 10 cm^3/s,the optimal heat dissipation can be achieved when the S-curve micro-channel number is 60,width is 60μm and height is 250μm.The maximum heat dissipation power density exceeds 800 W/cm^2.

关 键 词：微系统 微流道 散热特性 功率密度 

分 类 号：TP391.99[自动化与计算机技术—计算机应用技术]