几种5G用挠性覆铜板结构  

Several FCCL for 5G

作　　者：林均秀 Lin Junxiu

机构地区：[1]珠海元盛电子科技股份有限公司,广东珠海519060

出　　处：《印制电路信息》2020年第12期33-35,共3页Printed Circuit Information

摘　　要：5G通讯要求挠性印制板基材(FCCL)具有较低的损耗,常规聚酰亚胺(PI)膜不适于直接应用于高频高速通讯。5G FCCL除了研发新型低损耗材料外,也可以通过对PI改性,或者对FCCL的胶粘剂改性,搭配不同的叠层结构制造出FCCL,可以应用于不同程度的高频高速通讯。5G communication requires FPCB material FCCL has low loss.The normal PI is not suitable for direct application in high-frequency and high-speed communication.In addition to developing new low loss materials,5G FCCL can also be made by modifying PI or adhesive of FCCL.Manufacturing FCCL with different laminated structures and the material can be applied to different degrees of high-frequency and high-speed communication.

关 键 词：5G挠性印制板 挠性覆铜板 叠层结构 

分 类 号：TN41[电子电信—微电子学与固体电子学]