CSP焊点焊后残余应力分析与预测  

Analysis and Prediction of Residual Stress after Reflow Soldering of CSP Solder Joints

作　　者：黄春跃[1] 赵胜军 梁颖[2] 匡兵[1] 唐香琼 HUANG Chun-yue;ZHAO Sheng-jun;LIANG Ying;KUANG Bing;TANG Xiang-qiong(College of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004;Department of Electronic Engineering,Chengdu Aeronautic Vocational and Technical College,Chengdu 610021)

机构地区：[1]桂林电子科技大学机电工程学院,桂林541004 [2]成都航空职业技术学院电子工程系,成都610021

出　　处：《电子科技大学学报》2021年第1期148-154,共7页Journal of University of Electronic Science and Technology of China

基　　金：广西自然科学基金(2019JJA160101);广西科技重大专项(桂科)(AA19046004);四川省科技计划(2018JY0292);军委装备发展部“十三五”装备预研领域基金项目。

摘　　要：该文建立了芯片尺寸封装(CSP)焊点有限元分析模型并对其进行了再流焊焊后残余应力应变分析。以焊点直径、焊点高度、焊盘直径和焊点间距为输入参数,焊后残余应力为输出参数进行了灵敏度分析。选取灵敏度分析结果中对残余应力影响显著的因子作为输入,建立了带动量项神经网络预测模型,对CSP焊点焊后残余应力进行了预测。结果表明,置信度为95%时,焊点直径、焊盘直径和焊点间距对CSP焊点残余应力影响显著,灵敏度从大到小的排序为:焊点直径>焊盘直径>焊点间距。所建立的带动量项神经网络预测模型对CSP焊点焊后残余应力预测最大相对误差为7.93%,平均误差为3.19%,实现了对CSP焊点焊后残余应力准确预测。A finite element model of chip scale package(CSP)solder joints is established,the paper also analyzes the residual stress and strain after reflow soldering.Put solder joint height,solder joint diameter,solder joint pad diameter and solder joints pitch as input parameters,and the maximum residual stress after reflow soldering as output parameter to analyze the sensitivity of the CSP solder joints.Select the factors that have significant influence on residual stress,establish neural network with momentum term prediction model and predict the residual stress of CSP solder joints.The results show that the significant factors affect the residual stress of the CSP solder joints are the solder joint diameter,solder joint pad diameter and solder joint pitch when the confidence is 95%.The order is solder joint diameter,solder joint pad diameter and solder joint pitch.The maximum relative error of the neural network with momentum term prediction model for prediction residual stress after reflow welding of CSP solder joints is 7.93%,the average error is 3.19%,which complete the accurate prediction of the residual stress.

关 键 词：芯片尺寸封装 带动量项神经网络 再流焊 残余应力 灵敏度分析 

分 类 号：TG404[金属学及工艺—焊接]