橡胶颗粒对玻化微珠保温砂浆基本性能的影响  

Influence of Rubber Particle on Basic Properties of Glazed Hollow Beads Thermal Insulation Mortar

作　　者：蒋连接[1] 朱方之[1] 马静[1] 施云 罗海艳[1] 高立 JIANG Lianjie;ZHU Fangzhi;MA Jing;SHI Yun;LUO Haiyan;GAO Li(Department of Architectural Engineering,Suqian College,Suqian 223800,China)

机构地区：[1]宿迁学院建筑工程学院,宿迁223800

出　　处：《结构工程师》2020年第6期123-128,共6页Structural Engineers

基　　金：江苏省高校自然科学研究项目(18KJD560005,15KJB580012);江苏省第五期“333工程”培养资金资助项目(BRA2017273);宿迁市科技计划项目(Z2018218,Z2019107);宿迁学院科研基金项目(2016KY05)。

摘　　要：在玻化微珠保温砂浆中掺加改性橡胶颗粒,制备了20组复合保温砂浆试块,研究了橡胶颗粒掺量和粒径对砂浆抗压强度和导热系数的影响规律。结果表明:无论掺何种细度的橡胶颗粒,随着掺量的增加,复合保温砂浆的抗压强度显著降低,导热系数不断减小,保温性能随之提高;在橡胶颗粒掺量相同的情况下,随着橡胶颗粒粒径的增大,复合保温砂浆的抗压强度先增大后减小,导热系数逐渐变大,细橡胶颗粒更有助于提高砂浆的保温性能。对于三种橡胶粒径,配制复合保温砂浆时不建议使用(2.36-4)mm粗橡胶颗粒,使用(0.55-2.36)mm橡胶颗粒时宜将掺量控制在30%左右,使用(0.38-0.55)mm细橡胶颗粒时宜将掺量控制在20%以下。Twenty groups of glazed hollow beads thermal insulation mortar samples mixed with modified rubber particles were prepared,and influence of rubber particles content and size on compressive strength and thermal conductivity of mortar were studied.The results showed that with the increase of rubber particle content,the compressive strength of composite thermal insulation mortar mixed with any kind of rubber particle decreased significantly,the thermal conductivity decreased continuously,and the thermal insulation performance improved accordingly.Under the same mbber content,with the increase of rubber particle size,the compressive strength of composite thermal insulation mortar increased first and then decreases,and the thermal conductivity gradually increases,fine rubber particles were more conducive to improve the thermal insulation performance of mortar.For the three rubber particle sizes,when preparing composite thermal insulation mortar,it was not recommended to use(2.36-4)mm coarse rubber particles,and was appropriate to control the content of(0.55-2.36)mm rubber particles at about 30%and the content of(0.38-0.55)mm fine rubber particles at less than 20%.

关 键 词：橡胶颗粒 玻化微珠保温砂浆 抗压强度 导热系数 

分 类 号：TU578.1[建筑科学—建筑技术科学]