印制电路板加速寿命试验方法综述  

Summary of accelerated life test method for Printed Circuit Board

作　　者：刘立国[1] 张永华[1] 高蕊 Liu Liguo;Zhang Yonghua;Gao Rui(不详)

机构地区：[1]无锡江南计算技术研究所军用印制板质量检测中心,江苏无锡214083

出　　处：《印制电路信息》2021年第1期33-38,共6页Printed Circuit Information

摘　　要：寿命试验是一种重要的可靠性试验,基于加速寿命试验方法和大数据分析的印制板可靠性评估技术,未来应用前景广大。文章综合阐述了可应用于印制板加速寿命试验的常用加速寿命试验模型、加速因子计算和加速寿命试验方法,希望能够为业内相关研究和应用者提供一定指导和帮助。Life test is an important reliability test.The future application prospects of the printed circuit board reliability evaluation technology based on accelerated life test methods and big data analysis is broad.This article mainly comprehensively expounds the commonly used accelerated life test models,acceleration factor calculations and accelerated life test methods that can be applied to the accelerated life test of printed boards.The article hope to providecertain guidance and assistance to relevant researchers and users in the industry.

关 键 词：印制电路板 加速模型 加速因子 试验方法 

分 类 号：TN41[电子电信—微电子学与固体电子学]