Cu中间层对GH4099与Mo-Cu合金HIP扩散焊接头的影响  

Effect of Cu Interlayer on GH4099 and Mo-Cu Joint of HIP Diffusion Bonding

作　　者：王铁军[1,2] 张龙戈[1] 车洪艳 董浩[2,3] 郑天明 周双双[2,3] 王学远 WANG Tiejun;ZHANG Longge;CHE Hongyan;DONG Hao;ZHENG Tianming;ZHOU Shuangshuang;WANG Xueyuan(Central Iron&Steel Research Institute,Beijing 100081,China;Advanced Technology&Materials Limited Company,Beijing 100081,China;Engineering and Technology Research Center of Hot Isostatic Pressing,Baoding 072750,China;State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal,Lanzhou 730050,China)

机构地区：[1]钢铁研究总院,北京100081 [2]安泰科技股份有限公司,北京100081 [3]河北省热等静压工程技术研究中心,保定072750 [4]有色金属先进加工与再利用省部共建国家重点实验室,兰州730050

出　　处：《材料导报》2021年第2期2098-2102,共5页Materials Reports

基　　金：国家自然科学基金(51675255,51761027)。

摘　　要：Mo-Cu合金作为一种新型的高温合金材料,既具有高熔点、低膨胀系数等性能,又具备高延展性、高导电导热性等特性,可应用到航空航天、核工业、电子等诸多领域。如何将Mo-Cu合金与耐高温、抗氧化的GH4099高温合金连接制成复合构件,从而避免钼合金高温抗氧化能力较差、易产生低温脆性的缺点,是其作为高温结构材料能够更广泛应用而亟待解决的问题。常规焊接方法难以实现难熔合金的有效焊接,用热等静压工艺可以避免在焊接区域内再结晶,实现对形变速率敏感的材料的大面积连接。鉴于此,本工作采用不同厚度Cu中间层对GH4099/Mo-Cu HIP扩散焊接头质量进行了对比分析,利用PVD/箔纸制备Cu中间层,在一定的工艺参数下对扩散偶进行连接。对不同厚度Cu中间层焊后接头的界面元素迁移、扩散层演化和断口形貌进行了SEM-EDS表征,并用硬度、拉伸和剪切实验测试了接头的力学性能。结果表明:Cu中间层有利于扩散偶的连接,PVD镀层作中间层优于箔纸。Mo-Cu alloy,as a new type of superalloy material,not only has the properties of high-melting-point,low expansion coefficient,but also has the properties of high ductility,high electric conduction and thermal conductivity.It can be applied to lots of fields such as aerospace,nuclear industry,electronics,etc.There’s a burning problem to be solved that how to connect Mo-Cu alloy with GH4099 superalloy which is resis-tant to high temperature and oxidation,to make composite components,so as to avoid the poor high temperature oxidation resistance of Mo alloy,and the disadvantage of low temperature brittleness.As it can be widely used as high temperature structural material.In general,traditional wel-ding is difficult to achieve effective bonding of refractory alloy.HIP can avoid recrystallization in the welding area,what’s more,the large area connection can be realized for materials sensitive to deformation rate.For this reason,the quality of GH4099/Mo-Cu HIP diffusion bonding joints are compared and analyzed by using different thickness of Cu interlayer in this paper.Preparation of Cu interlayer by PVD,the diffusion couples are connected under the proper welding parameters.The interface element migration,diffusion layer evolution and fracture morphology which with different thickness of Cu interlayer were characterized by SEM-EDS,and the mechanical properties of the joint were tested by hardness,tensile and shear tests.The results show that Cu interlayer is beneficial to the connection of diffusion bonding,the PVD coating is better than the foil as the interlayer.

关 键 词：中间层 扩散连接 热等静压 物理气相沉积 

分 类 号：TG453[金属学及工艺—焊接]